Closed-loop control of wafer polishing in a chemical...

Details Closed-loop control of wafer polishing in a chemical... Closed-loop control of wafer polishing in a chemical...

2006-03-28

2006-03-28

Hail, III, Joseph J. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S005000, C451S008000, C451S011000, C451S285000, C451S286000, C451S287000, C451S288000

Reexamination Certificate

active

07018275

ABSTRACT:
Techniques for polishing a wafer (10) include closed-loop control. The wafer can be held by a carrier head (100) having at least one chamber whose pressure is controlled to apply a downward force on the wafer. Thickness-related measurements of the wafer can be obtained during polishing and a thickness profile for the wafer is calculated based on the thickness-related measurements. The calculated thickness profile is compared to a target thickness profile. The pressure in at least one carrier head chamber is adjusted based on results of the comparison. The carrier head chamber pressures can be adjusted to control the amount of downward force applied to the wafer during polishing and/or to control the size of a loading area on the wafer against which the downward force is applied.

REFERENCES:
patent: 5081796 (1992-01-01), Schultz
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5658183 (1997-08-01), Sandhu et al.
patent: 5730642 (1998-03-01), Sandhu et al.
patent: 5820448 (1998-10-01), Shamouilian et al.
patent: 5985094 (1999-11-01), Mosca
patent: 6159073 (2000-12-01), Wiswesser et al.
patent: 6368189 (2002-04-01), Maloney et al.
patent: 6422927 (2002-07-01), Zuniga
patent: 3801969 (1989-07-01), None
patent: 0879678 (1998-11-01), None
patent: 0904895 (1999-03-01), None
patent: 0914828 (1997-06-01), None

Affiliated with

Also associated with

Rating

Closed-loop control of wafer polishing in a chemical... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Closed-loop control of wafer polishing in a chemical..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Closed-loop control of wafer polishing in a chemical... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3557371