Cleaning of a substrate support

Details Cleaning of a substrate support Cleaning of a substrate support

2004-07-09

2010-02-02

Xu, Ling (Department: 1794)

Stock material or miscellaneous articles

Composite

Of metal

C428S192000, C428S336000, C428S337000, C428S339000, C428S473500, C428S689000, C428S699000, C428S701000, C428S702000, C428S426000, C428S432000, C428S325000, C428S412000, C428S446000, C428S450000, C428S457000

Reexamination Certificate

active

07655316

ABSTRACT:
A cleaning wafer cleans process residues from a support surface used in the processing of a substrate in an energized gas. The cleaning wafer has a disc having a liquid precursor derived polyimide layer formed directly on the disc by applying a liquid polyimide precursor to the disc. The polyimide layer has a thickness of less than about 50 microns, and a cleaning surface shaped to match a contour of the support surface. Process residues adhere to the cleaning surface and are cleaned from the support surface upon removal of the cleaning wafer therefrom.

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Van Landingham, “Review of Instrumented Indentation”, J. Res. Natl. Inst. Stand. Techno., Jul.-Aug. 2003, v.108, 249-265, Nat'l Inst. of Standards and Tech, Gaithersburg, MD.

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