Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate
2005-08-09
2005-08-09
Vinh, Lan (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
C438S756000, C252S079100, C134S001200
Reexamination Certificate
active
06927176
ABSTRACT:
The present invention is a novel cleaning method and a solution for use in a single wafer cleaning process. According to the present invention the cleaning solution comprises ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2), water (H2O) and a chelating agent. In an embodiment of the present invention the cleaning solution also contains a surfactant. And still yet another embodiment of the present invention the cleaning solution also comprises a dissolved gas such as H2. In a particular embodiment of the present invention, this solution is used by spraying or dispensing it on a spinning wafer.
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Truman J. Kelly
Verhaverbeke Steven
Applied Materials Inc.
Blakely & Sokoloff, Taylor & Zafman
Ulmez-Eronini Lynette T.
Vinh Lan
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