Circuit tape having adhesive film, semiconductor device, and a m

Details Circuit tape having adhesive film, semiconductor device, and a m Circuit tape having adhesive film, semiconductor device, and a m

1997-05-16

2000-09-05

Picard, Leo P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257778, 257783, 257782, 438107, 438123, H01L 23485, H01L 23495

Patent

active

061147532

ABSTRACT:
A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for the mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200-250.degree. C.).

REFERENCES:
patent: 5561323 (1996-10-01), Andros et al.
patent: 5668405 (1997-09-01), Yamashita
patent: 5800758 (1998-09-01), Topolkaraev et al.
patent: 5866949 (1999-02-01), Schueller
patent: 5895965 (1999-04-01), Tanaka et al.

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