Circuit support for a semiconductor chip and component

Details Circuit support for a semiconductor chip and component Circuit support for a semiconductor chip and component

2007-08-14

2007-08-14

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S786000, C257SE23040, C438S118000

Reexamination Certificate

active

11099823

ABSTRACT:
A circuit support for a semiconductor chip with a substrate made of an insulating material has a chip mounting area and a plurality of bonding pads surrounding the chip mounting area. The chip can be applied in a central area of the chip mounting area. A peripheral area surrounding the central area defines the border of the chip mounting area and it is of a far greater length than a length of the lateral edges of the chip to be mounted.

REFERENCES:
patent: 6204555 (2001-03-01), Iovdalsky
patent: 6818538 (2004-11-01), Chiang et al.
patent: 2001/0050422 (2001-12-01), Kishimoto et al.
patent: 2004/0212083 (2004-10-01), Yang
patent: 2005/0263861 (2005-12-01), Ahn et al.
patent: 03-064056 (1991-03-01), None
patent: 06-342817 (1994-12-01), None
patent: 10-163407 (1998-06-01), None

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