Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate
2007-11-06
2007-11-06
Nguyen, Sang H. (Department: 2886)
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
C356S237100, C356S237500, C356S394000, C250S310000, C250S397000
Reexamination Certificate
active
10896895
ABSTRACT:
The disclosed subject matter is related to a circuit pattern inspection apparatus for detecting a gradual changing of defect expanding over a large area of the semiconductor wafer. In order to detect a gradual changing of a defect related condition expanding over a large area of the semiconductor wafer, comparison is made between dies on a wafer that are separated from each other by a distance of at least one die width. For example, when a value according to a difference between such dies exceeds a pre-determined value, an existence of the gradual changing can be confirmed.
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Hayakawa Kouichi
Hiroi Takashi
Nara Yasuhiko
Nojiri Masaaki
Hitachi High-Technologies Corporation
McDermott Will & Emery LLP
Nguyen Sang H.
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