Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-10-24
2006-10-24
Dang, Trung (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S614000, C438S381000
Reexamination Certificate
active
07125788
ABSTRACT:
A circuit device includes at least one under bump metal formed on a surface of a substrate and a connection bump provided on the uppermost layer of the under bump metal. At least one laminated metallic film is formed on part of or all of wiring pattern formed on the surface of the substrate, so that the laminated metallic film formed consists of the same material and has the same thickness as the under bump metal.
REFERENCES:
patent: 6440836 (2002-08-01), Lu et al.
patent: 6781229 (2004-08-01), Fazelpour
patent: 6835595 (2004-12-01), Suzuki et al.
patent: 6861749 (2005-03-01), Wu et al.
patent: 2001/0045649 (2001-11-01), Sumikawa et al.
patent: 2002/0001773 (2002-02-01), Tahara et al.
patent: 2002/0017730 (2002-02-01), Tahara et al.
patent: 2002/0079576 (2002-06-01), Seshan
patent: 2002/0149086 (2002-10-01), Aoki
patent: 2002/0185749 (2002-12-01), Farnworth
patent: 2005/0167780 (2005-08-01), Edelstein et al.
patent: 8-172161 (1996-07-01), None
patent: 9-330817 (1997-12-01), None
patent: 10-079428 (1998-03-01), None
patent: 2001-332653 (2001-11-01), None
patent: 2002-280486 (2002-09-01), None
patent: 2003-142525 (2003-05-01), None
patent: 2003-318212 (2003-11-01), None
patent: 2001-107254 (2004-04-01), None
patent: WO 00/77844 (2000-12-01), None
Domon Takaaki
Kondo Ryoichi
Nagatsuka Toshiyuki
Yasui Tsutomu
Dang Trung
Ledig, Voit & Mayer, Ltd.
TDK Corporation
LandOfFree
Circuit device and method of manufacturing the circuit device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Circuit device and method of manufacturing the circuit device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit device and method of manufacturing the circuit device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3716391