4. Metal fusion bonding
  5. Process
  6. With protecting of work or filler or applying flux

Toshiyuki Nagatsuka

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Circuit device and method of manufacturing the circuit device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Electronic component including piezo-electric resonator...

Wave transmission lines and networks – Plural channel systems – Having branched circuits
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method for soldering electronic components

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Toshiyuki Nagatsuka does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Toshiyuki Nagatsuka, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Toshiyuki Nagatsuka will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-393996

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure