Circuit component and method of manufacture

Details Circuit component and method of manufacture Circuit component and method of manufacture

2007-06-26

2010-06-15

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S123000

Reexamination Certificate

active

07736951

ABSTRACT:
An inductor, a semiconductor component including the inductor, and a method of manufacture. A leadframe has a plurality of conductive strips and a flag. A ferrite core is mounted on a die attach material disposed on the conductive strips and a semiconductor die is mounted on a die attach material disposed on the flag. Wire bonds are formed from the conductive strips on one side of the ferrite core to corresponding conductive strips on an opposing side of the ferrite core. The wire bonds and the conductive strips cooperate to form the coil of the inductor. Wire bonds electrically couple one end of the inductor to leadframe leads adjacent the semiconductor die. Wire bonds couple bond pads on the semiconductor die to the leadframe leads coupled to the inductor. An encapsulant is formed around the inductor and the semiconductor die. Alternatively, a stand-alone inductor is manufactured.

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