Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-12-22
1999-06-22
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361704, 174252, 174256, 428901, H05K 720
Patent
active
059148616
ABSTRACT:
A circuit-board overlaid with a copper material on both sides with a lead-tin layer on the copper material and a plate-shaped heat sink (6). To achieve desirable dissipation of heat generated by electronic components on such circuit-board, the heat sink (6) is provided with a copper surface and then a layer of silver (8) applied to it is soldered to one side of the circuit-board (1). In a method of fabricating the circuit-board, a heat sink (6) having a copper surface is provided with a silver layer (8) and is applied to the circuit board (1) with its side (7) having the silver layer (8). The heat sink (6) is pressed with the circuit board (1) and a heated platen (20) in close contact with the heat sink (6).
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IPC-Standard, "Proposal Qualification and Performance Specification for Metal Core Boards," Institute for Interconnecting and Packaging Electronic Circuits, 1985, pp. 1-5.
"Thermal Enhancement for a Printed Wiring Board, Thermal Finger Pad," IBM Technical Disclsoure Bulletin, vol. 33, No. 4, Sep. 1990, NY, US, pp. 403-404.
Druckschrift, "Roger High Frequency Circuit Materials RO 4000.TM." der Firma Rogers Corporation, Chandler, AZ, USA.
Berchtold Dieter
Diehm Peter
Lancki Marian
Richter Dietrich
Straub Peter
Chervinsky Boris L.
Picard Leo P.
PPC Electronic AG
Siemens AG
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