4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Peter Straub

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Circuit-board overlaid with a copper material on both sides or i

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Circuit-board overlaid with a copper material on both sides or i

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Device for producing a rotating flow

Furnaces – With exhaust gas treatment means – Afterburning means
Reexamination Certificate

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Printed circuit board and method for producing a printed...

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Reexamination Certificate

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Process for manufacturing fiber reinforced light metal castings

Metal founding – Process – Shaping liquid metal against a forming surface
Patent

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Profile ID: LFUS-PAI-P-192814

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