Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
1999-06-15
2001-04-17
Lee, Eddie C. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S690000, C257S701000
Reexamination Certificate
active
06218736
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to circuit boards and semiconductor devices used in information and communication equipment and a method of manufacturing the same.
BACKGROUND OF THE INVENTION
In recent years, semiconductor devices have been required to be smaller, thinner, lighter in weight and cheaper in cost in response to the development of information and communication equipment and technical advancements such as a higher speed of signal processing as well as employing a higher frequency. Semiconductor devices as small as a semiconductor IC (bare chip) are proposed in various forms.
FIG.
8
and
FIG. 9
illustrate a general construction of a semiconductor device, i.e. electrode pad
103
a
is disposed on board
101
so that pad
103
a
faces to electrode
106
of semiconductor IC
105
. Further, wiring pattern
102
is provided with pad
103
a
in order to electrically couple pad
103
a
to a mother board (not shown). Electrode
106
of semiconductor IC
105
is coupled to electrode pad
103
a
of board
101
via protrusion
103
b
such as a semiconductor bump formed on each electrode
106
. Protrusions
103
b
are formed on respective electrodes
106
individually by using bump-forming-apparatus
110
shown in FIG.
10
.
In the conventional construction discussed above, protrusions
103
b
are individually formed on respective electrodes
106
. This time consuming process prevents a forming time from being shortened. As a result, this type of construction has been a bottleneck for reducing the cost of semiconductor devices. Further, respective protrusions
103
b
are desirably formed in an identical shape and at the same height so that electrode
106
of IC
105
can be perfectly conductive with electrode pad
103
a
of board
101
. However, the conventional method discussed above rarely produces protrusions
103
b
in the identical shape.
SUMMARY OF THE INVENTION
The present invention addresses the problems discussed above. It provides circuit boards having protrusions with the same shape as well as semiconductor devices employing the circuit board, and realizes a method of manufacturing the same.
The circuit board of the present invention is mounted with electronic components, and comprises wiring patterns on the board surface and protrusions disposed at desired locations on the wiring patterns. The protrusions are made of the same conductive material as used in the wiring patterns.
The semiconductor device of the present invention comprises the following elements:
(a) semiconductor chip components;
(b) a board;
(c) wiring patterns disposed on the board; and
(d) protrusions disposed at desired locations on the wiring patterns.
The protrusions are electrically coupled with electrodes provided to the semiconductor chips mounted on the board, and are made of the same conductive material as used in the wiring patterns.
The method of manufacturing the board of the present invention forms the wiring patterns and protrusions unitarily and simultaneously.
The construction according to the present invention allows the protrusions to be formed unitarily on the wiring patterns, so that the protrusions are always formed in the same shape, and respective electrical connections between the wiring patterns, protrusions and electronic components are ensured.
REFERENCES:
patent: 5547530 (1996-08-01), Nakamura et al.
patent: 5670418 (1997-09-01), Ghosal
patent: 5796590 (1998-08-01), Klein
patent: 5811317 (1998-09-01), Maheshwari et al.
patent: 5973405 (1999-10-01), Keukelaar et al.
patent: 0582052 (1994-02-01), None
Yagi Yuji
Yasuho Takeo
Clark Jhihan B
Lee Eddie C.
Matsushita Electric - Industrial Co., Ltd.
Parkhurst & Wendel LLP
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