Circuit and substrate encapsulation methods

Details Circuit and substrate encapsulation methods Circuit and substrate encapsulation methods

2006-08-15

2006-08-15

Lenbentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S112000, C438S124000, C438S126000, C438S127000

Reexamination Certificate

active

07091060

ABSTRACT:
A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the substrate. Encapsulation of the substrate edge by the cover reduces penetration of moisture or other contaminants into the substrate. The cover includes a rib that extends to contact a circuit board to which the ball grid array assembly is connected. With such a rib, planarity between the circuit board and the substrate is maintained during soldering.

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