Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1997-12-19
2000-04-11
Fahmy, Wael
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257738, 257778, 257784, 257787, H01L 2348
Patent
active
060491299
ABSTRACT:
An integrated circuit package (30) comprising a substrate (70) having an opening (86) and first and second surfaces (92, 94), a plurality of routing strips (82) being integral with the substrate (70) and extending to opening (86), a plurality of pads (100) disposed on the first surface (92) and electrically connected with at least one of the routing strips (82), a chip (50) having bonding pads (120) is adhered to the second surface (84) of the substrate (70) and is of substantially the same outline as substrate (70), wire bonding (80) electrically connecting at least one bonding pad (120) to at least one of the routing strips (82) and potting material (90) filling the opening (86) is disclosed.
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Chan Min Yu
Coyle Anthony
Ong Pang Hup
Swee Yong Khim
Yew Chee Kiang
Donaldson Richard L.
Fahmy Wael
Hoel Carlton H.
Potter Roy
Texas Instruments Incorporated
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