4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Shih-Hsiung Lin

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active

Bonding structure with pillar and cap

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Chip package with multiple chips connected by bumps

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Method for fabricating circuit component

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Profile ID: LFUS-PAI-P-1818859

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