Chip package with channel stiffener frame

Details Chip package with channel stiffener frame Chip package with channel stiffener frame

2011-08-30

2011-08-30

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S121000, C438S127000, C257SE21499

Reexamination Certificate

active

08008133

ABSTRACT:
Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and a first plurality of passive devices on the first side. A stiffener frame is coupled on the first side. The stiffener frame has first and second spaced apart opposing walls that define a channel in which the first plurality of passive devices is positioned, and a central opening that does not cover a central portion of the first side of the substrate.

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