Surface mount optoelectronic component with lens having...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor

Reexamination Certificate

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C257S098000

Reexamination Certificate

active

08008119

ABSTRACT:
The invention relates to a surface mount optoelectronic component with a lens attachment, the method for precising the lens position and the method to manufacture the whole component.

REFERENCES:
patent: 5034347 (1991-07-01), Kakihana
patent: 6610563 (2003-08-01), Waitl et al.
patent: 7279346 (2007-10-01), Andrews et al.
patent: 7326583 (2008-02-01), Andrews et al.
patent: 2003/0185526 (2003-10-01), Höhn et al.
patent: 2005/0018977 (2005-01-01), Beer et al.
patent: 2005/0121820 (2005-06-01), Rolston et al.
patent: 2005/0242056 (2005-11-01), Ho et al.

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