Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-08-30
2011-08-30
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C257S098000
Reexamination Certificate
active
08008119
ABSTRACT:
The invention relates to a surface mount optoelectronic component with a lens attachment, the method for precising the lens position and the method to manufacture the whole component.
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Low Tek Beng
Tay Kheng Chiong
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Le Thao P.
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