4. Equipment for production, distribution, or transformation of ene
  5. Distribution, modification or control
  6. Semiconductor, transistor or integrated circuit

Chia-Ken Leong

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Chip package with channel stiffener frame

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Circuit package lid

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit
Design Patent

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Profile ID: LFUS-PAI-P-2190957

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