Chemical vapor deposition method

Details Chemical vapor deposition method Chemical vapor deposition method

2005-03-14

2008-08-12

Chen, Bret (Department: 1792)

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

C117S092000

Reexamination Certificate

active

07410676

ABSTRACT:
A chemical vapor deposition method comprises steps of: a) injecting a source gas into a chamber so that the source gas is adsorbed on a substrate; b) injecting a purge gas into the chamber for a predetermined period of time so that the source gas remaining in the chamber is purged; c) injecting a reactant gas into a plasma generating portion, and generating plasma at the plasma generating portion by applying a first-level RF power source to a RF electrode plate so that radical of the reactant gas is adsorbed on the substrate; d) injecting a purge gas into the chamber for a predetermined period of time so that the reactant gas remaining in the chamber is purged; and e) applying a second-level RF power source to the plasma generating portion at the step a), b) and d) while the steps a) to d) are being repeated.

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