Chemical mechanical polishing with shear force measurement

Details Chemical mechanical polishing with shear force measurement Chemical mechanical polishing with shear force measurement

2005-03-22

2005-03-22

Lund, Jeffrie R. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C156S345120, C156S345150, C156S345240

Reexamination Certificate

active

06869498

ABSTRACT:
A chemical mechanical polishing system uses a shear force measurement system. Polishing parameters, such as the polishing pressure, can be adjusted in response to the measured shear force. For example, the pressure can be increased to avoid hydroplaning or decreased to avoid delamination or damage to a low-k dielectric film being polished. The shear force measurement system can include a sensor disk and one or more load cells.

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