Chemical-mechanical polishing with an embedded abrasive

Details Chemical-mechanical polishing with an embedded abrasive Chemical-mechanical polishing with an embedded abrasive

1995-08-03

1997-11-11

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566451, 216 88, 216 89, 451 41, H01L 21461

Patent

active

056859473

ABSTRACT:
A chemical-mechanical polishing process is described that provides high etch rates while at the same time minimizing the consumption of abrasives. This is achieved by embedding and dispersing the abrasive within the body of the material that is to be subjected to chemical-mechanical polishing.

REFERENCES:
patent: 5302233 (1994-04-01), Kim et al.
patent: 5318927 (1994-06-01), Sandhu et al.
patent: 5468682 (1995-11-01), Homma
patent: 5575886 (1996-11-01), Murase

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