Chemical mechanical polishing pad having improved groove...

Abrading – Flexible-member tool – per se – Interrupted or composite work face

Reexamination Certificate

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Details

C451S550000

Reexamination Certificate

active

08002611

ABSTRACT:
A chemical mechanical polishing pad and method for chemical-mechanical polishing is provided, wherein the polishing pad has a plurality of first mesas and one or more second mesas defined on a surface thereof. The plurality of first mesas are generally distributed about the surface of the polishing pad, wherein each of the plurality of first mesas has a first surface area associated therewith. The one or more second mesas are associated with a center region of the polishing pad, wherein each of the one or more second mesas has a second surface area associated therewith. The second surface area is at least twice the first surface area.

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