Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2006-07-11
2006-07-11
Wilson, Lee D. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S006000, C451S008000, C451S010000, C451S011000, C451S041000, C451S286000, C451S287000, C451S288000
Reexamination Certificate
active
07074109
ABSTRACT:
A system, method, and computer program product for chemical mechanical polishing a substrate in which initially a plurality of predetermined pressures are applied to a plurality of regions of the substrate. A plurality of portions of the substrate are monitored during polishing with an in-situ monitoring system. If the difference in thickness between two portions of the substrate exceeds a predetermined threshold, a plurality of adjusted pressures are calculated in a closed-loop control system, and the plurality of adjusted pressures are applied to the plurality of regions of the substrate. The predetermined threshold includes an initial threshold for the start of the polishing process and a second threshold for a period of polishing after the start of the polishing process.
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Bennett et al., U.S. Appl. No. 10/396,299, filed Mar. 23, 2003, 30 pp.
Bennett Doyle E
Birang Manoocher
David Jeffrey Drue
Swedek Boguslaw A
Zhang Jimin
Applied Materials
Fish & Richardson
McDonald Shantese L.
Wilson Lee D.
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