Chemical mechanical polishing control system and method

Abrading – Precision device or process - or with condition responsive... – Computer controlled

Reexamination Certificate

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Details

C451S006000, C451S008000, C451S010000, C451S011000, C451S041000, C451S286000, C451S287000, C451S288000

Reexamination Certificate

active

07074109

ABSTRACT:
A system, method, and computer program product for chemical mechanical polishing a substrate in which initially a plurality of predetermined pressures are applied to a plurality of regions of the substrate. A plurality of portions of the substrate are monitored during polishing with an in-situ monitoring system. If the difference in thickness between two portions of the substrate exceeds a predetermined threshold, a plurality of adjusted pressures are calculated in a closed-loop control system, and the plurality of adjusted pressures are applied to the plurality of regions of the substrate. The predetermined threshold includes an initial threshold for the start of the polishing process and a second threshold for a period of polishing after the start of the polishing process.

REFERENCES:
patent: 5081796 (1992-01-01), Schultz
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5658183 (1997-08-01), Sandhu et al.
patent: 5730642 (1998-03-01), Sandhu et al.
patent: 5731697 (1998-03-01), Li et al.
patent: 5738574 (1998-04-01), Tolles et al.
patent: 5840614 (1998-11-01), Sim et al.
patent: 5964653 (1999-10-01), Perlov et al.
patent: 5985094 (1999-11-01), Mosca
patent: 6159073 (2000-12-01), Wiswesser et al.
patent: 6252239 (2001-06-01), Goruganthu et al.
patent: 6280289 (2001-08-01), Wiswesser et al.
patent: 6399501 (2002-06-01), Birang et al.
patent: 6422927 (2002-07-01), Zuniga
patent: 6450868 (2002-09-01), Zuniga et al.
patent: 6494765 (2002-12-01), Gitis et al.
patent: 6572441 (2003-06-01), Lukner et al.
patent: 6602724 (2003-08-01), Redeker et al.
patent: 6609946 (2003-08-01), Tran
patent: 6609947 (2003-08-01), Moore
patent: 6669539 (2003-12-01), Amartur
patent: 6766215 (2004-07-01), Lensing et al.
patent: 6776692 (2004-08-01), Zuniga et al.
patent: 6801326 (2004-10-01), Finarov et al.
patent: 6806098 (2004-10-01), Ohtake et al.
patent: 6857945 (2005-02-01), Chen et al.
patent: 2001/0000773 (2001-05-01), Campbell et al.
patent: 2002/0098777 (2002-07-01), Laursen et al.
patent: 2002/0164925 (2002-11-01), Swedek et al.
patent: 2003/0199112 (2003-10-01), Shanmugasundram et al.
patent: 2005/0024047 (2005-02-01), Miller et al.
patent: 3801969 (1989-07-01), None
patent: 0904895 (1999-03-01), None
patent: 1066925 (2001-01-01), None
Bennett et al., U.S. Appl. No. 10/396,299, filed Mar. 23, 2003, 30 pp.

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