Chemical mechanical polishing composition and process

Details Chemical mechanical polishing composition and process Chemical mechanical polishing composition and process

2005-03-29

2005-03-29

Norton, Nadine G. (Department: 1765)

Compositions

Etching or brightening compositions

C438S692000

Reexamination Certificate

active

06872329

ABSTRACT:
A method and composition for planarizing a substrate surface is provided. The polishing composition includes an oxidizer capable of oxidizing a metal undergoing planarization and yielding a complexing agent which complexes with the oxidized metal and a stabilizer such as a stannate salt. The composition may further include abrasive particles and/or inhibitors. The composition may be used in a multi-step polishing process including polishing a substrate surface to selectively remove a metal layer with respect to a barrier layer and dielectric layer and polishing a substrate surface using the composition to non-selectively remove the metal layer, a barrier layer, and a dielectric layer from the substrate surface.

REFERENCES:
patent: 4465872 (1984-08-01), Suzuki et al.
patent: 4789648 (1988-12-01), Chow et al.
patent: 4867757 (1989-09-01), Payne
patent: 5014468 (1991-05-01), Ravipati et al.
patent: 5209816 (1993-05-01), Yu et al.
patent: 5340370 (1994-08-01), Cadien et al.
patent: 5437754 (1995-08-01), Calhoun
patent: 5453312 (1995-09-01), Haas et al.
patent: 5454844 (1995-10-01), Hibbard et al.
patent: 5692950 (1997-12-01), Rutherford et al.
patent: 5693563 (1997-12-01), Teong
patent: 5725417 (1998-03-01), Robinson
patent: 5738574 (1998-04-01), Tolles et al.
patent: 5756398 (1998-05-01), Wang et al.
patent: 5782675 (1998-07-01), Southwick
patent: 5783489 (1998-07-01), Kaufman et al.
patent: 5800577 (1998-09-01), Kido
patent: 5804507 (1998-09-01), Perlov et al.
patent: 5820450 (1998-10-01), Calhoun
patent: 5823855 (1998-10-01), Robinson
patent: 5842910 (1998-12-01), Krywanczyk et al.
patent: 5866031 (1999-02-01), Carpio et al.
patent: 5869392 (1999-02-01), Kimura
patent: 5879226 (1999-03-01), Robinson
patent: 5916012 (1999-06-01), Pant et al.
patent: 5932486 (1999-08-01), Cook et al.
patent: 5954997 (1999-09-01), Kaufman et al.
patent: 5961372 (1999-10-01), Shendon
patent: 5990010 (1999-11-01), Berman
patent: 6008405 (1999-12-01), Gray et al.
patent: 6030487 (2000-02-01), Fisher, Jr. et al.
patent: 6030899 (2000-02-01), Cook et al.
patent: 6046110 (2000-04-01), Hirabayashi et al.
patent: 6063306 (2000-05-01), Kaufman et al.
patent: 6068879 (2000-05-01), Pasch
patent: 6074949 (2000-06-01), Schonauer et al.
patent: 6083840 (2000-07-01), Mravic et al.
patent: 6096652 (2000-08-01), Watts et al.
patent: 6117775 (2000-09-01), Kondo et al.
patent: 6117783 (2000-09-01), Small et al.
patent: 6126853 (2000-10-01), Kaufman et al.
patent: 6210525 (2001-04-01), James et al.
patent: 6217416 (2001-04-01), Kaufman et al.
patent: 6244935 (2001-06-01), Birang et al.
patent: 6245679 (2001-06-01), Cook et al.
patent: 6251150 (2001-06-01), Small et al.
patent: 6270395 (2001-08-01), Towery et al.
patent: 6270396 (2001-08-01), Uchiyama
patent: 6293848 (2001-09-01), Fang et al.
patent: 6302766 (2001-10-01), Sethuraman et al.
patent: 6319096 (2001-11-01), Mueller et al.
patent: 6322427 (2001-11-01), Li et al.
patent: 6347981 (2002-02-01), Holzapfel
patent: 6348076 (2002-02-01), Canaperi et al.
patent: 6361422 (2002-03-01), Ettinger et al.
patent: 6435944 (2002-08-01), Wang et al.
patent: 6520840 (2003-02-01), Wang et al.
patent: 0 659 858 (1994-12-01), None
patent: 0 846 742 (1998-06-01), None
patent: 0 896 042 (1999-02-01), None
patent: 9849723 (1998-11-01), None
patent: 9953532 (1999-10-01), None
patent: 9961540 (1999-12-01), None
patent: 0000561 (2000-01-01), None
patent: 0000567 (2000-01-01), None
patent: 0112739 (2001-02-01), None
European Search Report, Oct. 2, 2001.
Austrian Search Report, Sep. 17, 2001.
Gurusamy, et al., “Method and Apparatus for Controlling a Pad Conditioning Process of a Chemical-Mechanical Polishing Apparatus” Feb. 10, 2000. USSN 09/502,560.
Wu, et al., “System and Method for Chemical Mechanical Planarization” May 31, 2000 USSN 09/583,512.
Tobin, et al., “Method and Apparatus for Controlling a Pad Conditioning Process of a Chemical-Mechanical Polishing Apparatus” Mar. 10, 2000 USSN 09/523,363.

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