Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1994-03-02
1997-07-22
Niebling, John
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
216 89, B41C 100
Patent
active
056500394
ABSTRACT:
A chemical mechanical polishing apparatus polishes substrates on a rotating polishing pad in the presence of a chemically active and/or physically abrasive slurry. At least one groove is provided in the surface of the polishing pad to allow slurry to reach the surface of the substrate, which is engaged with the polishing pad. The groove extends at least partially in a radial direction. Additionally, a pad conditioning apparatus may be placed onto the rotating polishing pad as substrates are being polished to continuously condition the polishing pad.
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Pp. 20 to 24 of EBARA CMP System Brochure.
Applied Materials Inc.
Chang Joni Y.
Niebling John
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