Abrading – Precision device or process - or with condition responsive... – Controlling temperature
Reexamination Certificate
2005-12-20
2005-12-20
Morgan, Eileen P. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Controlling temperature
C451S006000, C451S010000, C451S011000, C451S041000, C451S053000, C451S288000, C156S345160, C156S345250
Reexamination Certificate
active
06976902
ABSTRACT:
There is provided a chemical mechanical polishing apparatus, which may include a polishing table rotated by a polishing table motor and having a pad thereon, a carrier head located above the polishing table to be rotatable by the driving of a carrier head motor and having a wafer located under the bottom thereof, a slurry supplier for supplying a slurry to the upper portion of the polishing table, a first polishing end point detector for detecting a polishing end point through the temperature change of the temperature sensor, at least one temperature sensor for detecting the temperature of a polishing region (the wafer, the pad, and the slurry), and a second polishing end point detector for detecting a polishing end point from the changes of load current, voltage, and resistance of the carrier head motor. Further, instead of the second polishing end point detector, an optical signal polishing end point detector may be employed, for detecting the polishing end point by the light illuminated on the wafer and reflected from the wafer.
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Hah Sang-Rok
Hong Duk-Ho
Koo Ja-Eung
Lee Jong-Won
Lee Sung-Bae
Marger & Johnson & McCollom, P.C.
Morgan Eileen P.
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