Charged particle beam application system

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field

Reexamination Certificate

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Reexamination Certificate

active

07408760

ABSTRACT:
During the writing operation, the wafer potential is dynamically detected and corrected. By doing so, the positional accuracy of the circuit patterns written on a wafer can be improved. After a contact resistance between a wafer and a earth pin is measured, the current flowing from the wafer to the ground potential via the earth pin is measured. Then, based on the measurement result, the potential difference is given between the wafer and the ground potential.

REFERENCES:
patent: 5148036 (1992-09-01), Matsugu et al.
patent: 5179498 (1993-01-01), Hongoh et al.
patent: 5225892 (1993-07-01), Matsugu et al.
patent: 6716301 (2004-04-01), Kanno et al.
patent: 2005/0016685 (2005-01-01), Emoto et al.
patent: 11-111599 (1999-04-01), None
patent: 2001-257158 (2001-09-01), None
J. Phys. E. Sci. Instrum., vol. 14, 1981, “Deflection errors due to sample potential in electron beam lithography machine”, M. Miyazaki et al, pp. 194-195.

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