Chamber for wafer cleaning and method for making the same

Details Chamber for wafer cleaning and method for making the same Chamber for wafer cleaning and method for making the same

2011-03-01

2011-03-01

Markoff, Alexander (Department: 1711)

Cleaning and liquid contact with solids

Processes

With treating fluid motion

C134S031000, C134S902000

Reexamination Certificate

active

07896974

ABSTRACT:
A wafer processing chamber “chamber” is provided. Broadly speaking, the chamber allows a fluid flow and a fluid pressure within the chamber to be controlled in a variable manner. More specifically, the chamber utilizes removable plates that can be configured to control the fluid flow and the fluid pressure in an inner volume within the chamber. Also, the removable plates can be used to separate the inner volume within the chamber from an outer volume within the chamber. In this manner, the removable plates can be used to create a pressure differential between the inner volume within the chamber and the outer volume within the chamber. A lower pressure in the outer volume within the chamber requires less outer chamber strength to withstand the lower pressure. A lower outer chamber strength requirement translates into an overall decrease in chamber size.

REFERENCES:
patent: 6589361 (2003-07-01), Luscher et al.
patent: 6672864 (2004-01-01), Wang et al.
patent: 6848458 (2005-02-01), Shrinivasan et al.

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