Chamber configuration for confining a plasma

Details Chamber configuration for confining a plasma Chamber configuration for confining a plasma

2005-03-29

2005-03-29

Alejandro-Mulero, Luz (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

Having glow discharge electrode gas energizing means

C156S345470, C118S7230AN, C118S7230ER

Reexamination Certificate

active

06872281

ABSTRACT:
A plasma confining assembly for minimizing unwanted plasma formations in regions outside of a process region in a process chamber is disclosed. The plasma confining assembly includes a first confining element and second confining element positioned proximate the periphery of the process region. The second confining element is spaced apart from the first confining element. The first confining element includes an exposed conductive surface that is electrically grounded and the second confining element includes an exposed insulating surface, which is configured for covering a conductive portion that is electrically grounded. The first confining element and the second confining element substantially reduce the effects of plasma forming components that pass therebetween. Additionally, the plasma confining assembly may include a third confining element, which is formed from an insulating material and disposed between the first confining element and the second confining element, and proximate the periphery of the process region. The third confining element further reduces the effects of plasma forming components that pass between the first confining element and the second confining element.

REFERENCES:
patent: 4464223 (1984-08-01), Gorin
patent: 4632719 (1986-12-01), Chow et al.
patent: 5006192 (1991-04-01), Deguchi
patent: 5271788 (1993-12-01), Hasegawa et al.
patent: 5456757 (1995-10-01), Aruga et al.
patent: 5534751 (1996-07-01), Lenz et al.
patent: 5605637 (1997-02-01), Shan et al.
patent: 5900103 (1999-05-01), Tomoyasu et al.
patent: 5998932 (1999-12-01), Lenz
patent: 6019060 (2000-02-01), Lenz
patent: 6051100 (2000-04-01), Walko, II
patent: 6074518 (2000-06-01), Imafuku et al.
patent: 6279504 (2001-08-01), Takaki et al.
patent: 6444087 (2002-09-01), Nawata et al.
patent: 0678903 (1995-10-01), None
patent: 0814495 (1997-12-01), None
patent: 0821395 (1998-01-01), None
patent: 2251977 (1992-07-01), None
patent: WO-0000992 (2000-01-01), None

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