Ceramic mounting for wafer apparatus with thermal expansion...

Details Ceramic mounting for wafer apparatus with thermal expansion... Ceramic mounting for wafer apparatus with thermal expansion...

2007-03-12

2011-12-27

Ford, John (Department: 3784)

Heat exchange

Heating and cooling

Heating and cooling of the same material

C165S080100, C165S080200, C165S080400, C165S080500, C324S750030, C324S750080, C219S444100, C118S724000, C118S725000, C156S345520, C156S345530, C204S298150

Reexamination Certificate

active

08082977

ABSTRACT:
A mounting apparatus includes a surface plate; a temperature control unit integrated with the surface plate; and a bottom plate integrated with the temperature control unit via a heat insulation ring, wherein a temperature of a target object held on the surface plate is capable of being controlled and the surface plate is formed of ceramic. The surface plate and the temperature control unit are coupled to each other by a first coupling member at each portion thereof except for each peripheral portion thereof such that the peripheral portion of the surface plate being not coupled thereto. The peripheral portion of the temperature control unit is coupled to the heat insulation ring by a second coupling member.

REFERENCES:
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patent: 5716133 (1998-02-01), Hosokawa et al.
patent: 6605955 (2003-08-01), Costello et al.
patent: 7331097 (2008-02-01), Stone et al.
patent: 7425838 (2008-09-01), Itakura et al.
patent: 7518358 (2009-04-01), Dunklee
patent: 2005/0011768 (2005-01-01), Stone et al.
patent: 05036818 (1993-02-01), None
patent: 2002203664 (2002-07-01), None

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