Ceramic electrostatic wafer chuck

Details Ceramic electrostatic wafer chuck Ceramic electrostatic wafer chuck

1991-10-29

1993-05-04

Bishop, Steven C.

Chucks or sockets

With magnetic or electrostatic means

269 8, 361234, H01F 1302

Patent

active

052074374

ABSTRACT:
An electrostatic chuck for semiconductor wafers comprised of a multilayered ceramic, including a back-side-metal layer pattern adjacent the upper wafer receiving surface for generating an electrostatic force. Intermediate via layers connect the pattern to a back-side-metal layer at the bottom of the chuck to which power leads can be connected. A number of small passages, extending from the bottom of the chuck to its upper surface, allow helium heat transfer without the need for surface grooves.

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