Cast metal seal for semiconductor substrates and process thereof

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438614, 438615, 438616, 438686, 438687, 257704, 257710, H01L 2144

Patent

active

058211616

ABSTRACT:
The present invention relates generally to a new scheme of providing a seal for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal is a two layer, solder structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder structure has a thick high melting point temperature region that is attached to a cap, and a thin interconnecting region of lower melting point temperature region for sealing the substrate to the cap.

REFERENCES:
patent: 4020987 (1977-05-01), Hascoe
patent: 4291815 (1981-09-01), Gordon et al.
patent: 4322737 (1982-03-01), Sliwa, Jr.
patent: 4500945 (1985-02-01), Lipschutz
patent: 4746583 (1988-05-01), Falanga
patent: 5153709 (1992-10-01), Fukuoka
patent: 5244143 (1993-09-01), Ference et al.
patent: 5248250 (1993-09-01), Adachi
patent: 5275549 (1994-01-01), Yamasaki
patent: 5329160 (1994-07-01), Miura et al.
patent: 5380184 (1995-01-01), Von Holdt, Sr.
patent: 5395226 (1995-03-01), Sakai et al.
patent: 5414300 (1995-05-01), Tozawa et al.
patent: 5471027 (1995-11-01), Call et al.
patent: 5523260 (1996-06-01), Missele

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Cast metal seal for semiconductor substrates and process thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cast metal seal for semiconductor substrates and process thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cast metal seal for semiconductor substrates and process thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-312937

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.