Carbon nanotube conductor for trench capacitors

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S068000, C257S071000, C257S296000, C257S300000, C257SE27084, C257SE27092, C257SE23039, C257SE51040, C438S243000, C438S386000, C438S775000, C438S776000, C977S936000, C977S943000, C977S948000

Reexamination Certificate

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07932549

ABSTRACT:
A trench-type storage device includes a trench in a substrate (100), with bundles of carbon nanotubes (202) lining the trench and a trench conductor (300) filling the trench. A trench dielectric (200) may be formed between the carbon nanotubes and the sidewall of the trench. The bundles of carbon nanotubes form an open cylinder structure lining the trench. The device is formed by providing a carbon nanotube catalyst structure on the substrate and patterning the trench in the substrate; the carbon nanotubes are then grown down into the trench to line the trench with the carbon nanotube bundles, after which the trench is filled with the trench conductor.

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Yoshikazu Homma, Growth of Suspended carbon nanotube networks on 100-nm scale silicon pillars, Applied Physics Letters, vol. 81, No. 12, Sep. 16, 2002, pp. 2261-2263.
Yoshikazu Homma, Growth of suspended carbon nanotube networks on 100-nm -scale silicon pillars, Sep. 16, 2002 , vol. 81, No. 12, pp. 2261-2263 (Applied physics letters).
Yoshikazu Homma, Growth of suspended carbon nanotube networks on 100-nm scale pillars, Sep. 16, 2002, Applied physics letters, vol. 81, No. 12, pp. 2261-2263.
Yoshikazu Hmma, Growth of suspended carbon nanotube networks on 100-nm scale pillars, Sep. 16, 2002, Applied physics letters, vol. 81, No. 12, pp. 2261-2263.
International Search Report and Written Opinion Filing Date: Dec. 18, 2003.

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