Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Patent
1999-08-24
2000-10-03
Ryan, Patrick
Metal fusion bonding
With control means responsive to sensed condition
Work-responsive
228 22, 228 33, 228 39, 228 447, B23Q 1608, B23K 3706, B23K 100
Patent
active
061260592
ABSTRACT:
Disclosed are methods and apparatuses for forming solder bumps on integrated circuit chips (and other similar circuitized units) and apparatuses. A screening stencil is laid over the surface of the substrate and solder paste material is deposited into the stencil's apertures with a screening blade. The stencil is placed in such a manner that each of its apertures is positioned over a substrate pad, upon which a solder bump is to be formed. Next, a flat pressure plate is laid over the exposed top surface of the stencil, which creates a fully enclosed, or "captured", cell of solder paste within each stencil aperture. Then, with the stencil and plate remaining in place on top of the substrate, the substrate is heated to a temperature sufficient to reflow the solder paste material. After reflow, the substrate is cooled, and the pressure plate and stencil are thereafter removed, leaving solder bumps on the substrate. The use of the pressure plate ensures the proper formation of the solder bumps at high densities of solder bumps (i.e., high densities corresponding to small solder bump sizes and small pitch distances between solder bumps).
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Boucher Patricia R.
Love David G.
MacKay John T.
Molinaro Thomas E.
Fujitsu Limited
Ryan Patrick
Stoner Kiley
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