4. Metal fusion bonding
  5. With control means responsive to sensed condition
  6. Work-responsive

Patricia R. Boucher

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Apparatus for cooling semiconductor chips in multichip modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Captured-cell solder printing and reflow methods

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Captured-cell solder printing and reflow methods and apparatuses

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Patent

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Method of assembling thin film jumper connectors to a substrate

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Utility Patent

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Profile ID: LFUS-PAI-P-348896

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