Capacitor of semiconductor memory device that has composite...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Reexamination Certificate

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06897106

ABSTRACT:
A semiconductor memory device that includes a composite Al2O3/HfO2dielectric layer with a layer thickness ratio greater than or equal to 1, and a method of manufacturing the capacitor are provided. The capacitor includes a lower electrode, a composite dielectric layer including an Al2O3dielectric layer and an HfO2dielectric layer sequentially formed on the lower electrode, the Al2O3dielectric layer having a thickness greater than or equal to the HfO2dielectric layer, and an upper electrode formed on the composite dielectric layer. The Al2O3dielectric layer has a thickness of 30-60 Å. The HfO2dielectric layer has a thickness of 40 Å or less.

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English Language Abstract of Korean Publication No: P2001-0082118.
English Language Abstract of Korean Publication No: P2002-0002596.
English Language Abstract of Korean Publication No: P2002-0034520.

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