Capacitor integration at top-metal level with a protection...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S396000

Reexamination Certificate

active

07015093

ABSTRACT:
An on-chip decoupling capacitor (106) and method of fabrication. The decoupling capacitor (106) is integrated at the top metal interconnect level (104) and includes surface protection layer (109) for the copper metal (104b) of the top metal interconnect.

REFERENCES:
patent: 6746914 (2004-06-01), Kai et al.
patent: 2004/0145855 (2004-07-01), Block et al.

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