Camera module and method of fabricating the same

Details Camera module and method of fabricating the same Camera module and method of fabricating the same

2007-06-01

2009-06-23

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S433000, C257S618000, C257S680000, C257S684000, C257S685000, C257SE21001

Reexamination Certificate

active

07550812

ABSTRACT:
Example embodiments may provide a camera module including a high-resolution lens member and/or an image sensor chip that may be integrally formed, and a method of fabricating a camera module. Example embodiment camera modules may include a semiconductor package including an image sensor chip. A transparent substrate may include an upper plate portion and/or a supporting portion defined by a cavity under the upper plate portion, and the supporting portion may be attached on the semiconductor package. The upper plate portion may be spaced from the semiconductor package by the supporting portion. A lens member may be attached to the upper plate portion of the transparent substrate. A stop member may be formed on a top side of the transparent substrate and may expose a portion of the lens member.

REFERENCES:
patent: 2002-372603 (2002-12-01), None
patent: 10-2004-0054525 (2004-06-01), None
patent: 10-2004-0068864 (2004-08-01), None
patent: 10-2005-0033987 (2005-04-01), None

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