Buried layer contact for an integrated circuit structure

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257397, 257586, 257588, H01L 2976, H01L 2994, H01L 27082, H01L 27102

Patent

active

056147503

ABSTRACT:
A buried layer contact for a integrated circuit structure is provided, with particular application for a contact for a buried collector of a bipolar transistor. The buried layer contact takes the form of a sinker comprising a fully recessed trench isolated structure having dielectric lined sidewalls and filled with conductive material, e.g. doped polysilicon which contacts the buried layer. The trench isolated contact is more compact than a conventional diffused sinker structure, and thus beneficially allows for reduced transistor area. Advantageously, a reduced area sinker reduces the parasitic capacitance and power dissipation. In a practical implementation, the structure provides for an annular collector contact structure to reduce collector resistance.

REFERENCES:
patent: 5001538 (1991-03-01), Pollock et al.
patent: 5286996 (1994-02-01), Neudeck et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Buried layer contact for an integrated circuit structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Buried layer contact for an integrated circuit structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Buried layer contact for an integrated circuit structure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2205699

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.