Bumping process

Details Bumping process Bumping process

2006-09-26

2006-09-26

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE23012

Reexamination Certificate

active

07112523

ABSTRACT:
A method of forming a plurality of bumps over a wafer mainly comprises the steps of providing a wafer having a plurality of bonding pads, forming an adhesive layer on the surface of the wafer to cover the bonding pads, patterning the adhesive layer to expose the bonding pads to form a patterned adhesive layer, forming a barrier layer and a wetting layer on the patterned adhesive layer and the surface of the wafer, removing the barrier layer and the wetting layer not covering the patterned adhesive layer, forming a plurality of bumps on the patterned wetting layer, and reflowing the bumps.

REFERENCES:
patent: 5162257 (1992-11-01), Yung
patent: 5462638 (1995-10-01), Datta et al.
patent: 5508229 (1996-04-01), Baker
patent: 6013572 (2000-01-01), Hur et al.
patent: 6249044 (2001-06-01), Kao et al.
patent: 6293457 (2001-09-01), Srivastava et al.
patent: 6426281 (2002-07-01), Lin et al.
patent: 6570251 (2003-05-01), Akram et al.
patent: 6596619 (2003-07-01), Wang et al.
patent: 2004/0092092 (2004-05-01), Yang

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