4. Metal treatment
  5. Process of modifying or maintaining internal physical...
  6. With casting or solidifying from melt

Sang Ho Ahn

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Bumped chip carrier package using lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Bumped chip carrier package using lead frame and method for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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High speed tool steel

Metal treatment – Stock – Ferrous
Reexamination Certificate

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High speed tool steel, and manufacturing method therefor

Metal treatment – Process of modifying or maintaining internal physical... – With casting or solidifying from melt
Patent

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Large capacity optical ATM switch

Optical: systems and elements – Deflection using a moving element – Using a periodically moving element
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1860005

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