Bump levelling method and bump levelling apparatus

Details Bump levelling method and bump levelling apparatus Bump levelling method and bump levelling apparatus

1997-12-04

1999-05-04

Gerrity, Stephen F.

Presses

Methods

100 48, 100 99, 100229R, 100231, 257737, 257778, B30B 1514, H01L 2160

Patent

active

058991409

ABSTRACT:
A bump leveling method and a bump leveling apparatus in which the leveled height of bumps can be made constant and meet the change in thickness of an IC chip. A pressing force under which one bump is deformed to a prescribed height is measured. Thus, the pressing force under which a plurality of bumps can be deformed and leveled can be set. A load cell detects that a prescribed pressing force is exerted on the bumps and this pressing force is maintained, so that the plurality of bumps can be leveled up to the same prescribed height.

REFERENCES:
patent: 4784058 (1988-11-01), Nakagawa et al.

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