Bump formed on semiconductor device chip and method for...

Details Bump formed on semiconductor device chip and method for... Bump formed on semiconductor device chip and method for...

2006-07-11

2006-07-11

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S612000, C257S737000

Reexamination Certificate

active

07074704

ABSTRACT:
A bump of a semiconductor chip comprises a plurality of bond pads formed on a semiconductor chip, a conductive bump formed on the bond pads; and a sidewall insulating layer formed on sidewalls of the conductive bump. It is possible for the semiconductor chip to prevent electrical shorts and improve productivity even though a pitch of bond pad is decreased.

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