Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Reexamination Certificate
1998-12-17
2001-12-11
Dunn, Tom (Department: 1725)
Metal fusion bonding
With control means responsive to sensed condition
Work-responsive
C228S008000, C228S012000, C228S049500
Reexamination Certificate
active
06328196
ABSTRACT:
TECHNICAL FIELD
The present invention relates to a bump bonding device for forming bump electrodes on electrodes of semiconductor electronic parts, and its method.
BACKGROUND ART
Referring to
FIG. 6
to
FIG. 10
, conventional bump bonding device and bump bonding method are described below.
FIG. 6
is a perspective view of a bump bonding device for forming a bump on an electronic part
3
by using a gold wire
10
.
In the diagram, the electronic part
3
supplied from a tray
10
is fixed on a heated stage
1
by means of a suction collet
10
. A capillary
12
is held by an ultrasonic feed unit, and is provided with an ultrasonic wave, and a gold bump is formed on the electrode of the electronic part
3
by the capillary
12
in which the gold wire
13
is passed. After forming bumps on specified positions thereof, the electronic part
3
is stored in a tray
10
a
by means of the suction collet
11
.
FIGS.
7
(
a
)-
7
(
d
) are process diagrams showing the bump forming process.
First, at step (a), the gold wire
13
is passed in the capillary
12
, a spark is ignited on the tip of the gold wire
13
, and a ball is formed on the tip. At next step (b), the capillary
12
is lowered to press on an electrode
14
of the electronic part
3
. At this time, an ultrasonic wave is applied to bond the electrode
14
and gold wire
13
(1st bonding). At step (c), consequently, the capillary
12
is lifted, and is lowered again while controlling the loop, and, at step (d), the capillary
12
presses on the gold ball of first bonding, and cuts off the gold wire
13
(2nd bonding).
A regulating section of electronic parts is described in detail below.
FIG. 8
is a plan view of electronic parts regulating section.
As shown in
FIG. 8
, the regulating section of the bump bonding device is composed of a stage
1
having a suction hole, a regulating pawl
2
movable in the XY direction, and a regulating spring
5
for applying a regulating force in the Y direction of the regulating pawl
2
, in which the electronic part
3
moves on the suction hole of the stage
1
by means of the regulating pawl
2
, and is regulated in position on the stage
1
by vacuum suction. However, the suction force is insufficient for a tiny electronic part, a regulating section as shown in
FIG. 9
is used.
As shown in
FIG. 9
, the regulating section is composed a stage
1
, a plate
4
fixed at an end of the stage
1
, a regulating pawl
2
movable in the XY direction, and a regulating spring
5
for applying a regulating force in the Y direction of the regulating pawl
2
.
In this regulating section, it is hard to set the regulating pawl parallel to the plate
4
, and therefore when regulating the position of the electronic part
3
, if a regulating force is applied to the electronic part
3
by the regulating pawl
2
, a corner
3
a
of the electronic part may collide against the plate
4
, and the electronic part may be broken.
FIG. 10
is a flowchart showing operation by the conventional electronic parts regulating device.
The electronic part is put on the stage
1
of the bump bonding device, the suction device is turned on, the electronic part is positioned, and, in this state, the electronic part
3
is bonded. In the case of a tiny electronic part, however, the suction hole is not suited to the dimension of the electronic part, or the suction hole located on the regulating track of the electronic part cannot be blocked according to the dimension of the electronic part, and suction errors often took place.
Generally, a tiny electronic part is fragile, and therefore when handling a tiny electronic part, it is required to decrease the impact force when regulating the position to prevent breakage of electronic part. It is hence an object of the invention to present an electronic part of high reliability, free from breakage when positioning the electronic part. Besides, if suction error occurs, the electronic part is likely to be cooled and defective bonding is caused, and, therefore, by preventing suction error, it is also an object of the invention to present an electronic part of high reliability with a lower rate of defective bonding.
SUMMARY OF THE INVENTION
The bump bonding device of the invention comprises a stage for mounting and heating an electronic part, and a position regulating device of electronic part including a rotatable regulating plate having a side for positioning the electronic part, a plate having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring for applying a regulating force to the regulating plate in order to press the electronic part to the plate, and therefore the electronic part is regulated as being bonded between the regulating plate and the plate surface, and breakage is prevented, so that the reliability of electronic parts can be enhanced.
REFERENCES:
patent: 3696985 (1972-10-01), Herring et al.
patent: 3775579 (1973-11-01), Burghart et al.
patent: 4398350 (1983-08-01), Inoue
patent: 4892993 (1990-01-01), Stol
patent: 5264676 (1993-11-01), Kanaya et al.
patent: 5288008 (1994-02-01), Haji et al.
patent: 5377897 (1995-01-01), Zimmer
patent: 5788143 (1998-08-01), Boyd et al.
patent: 5958262 (1999-09-01), Palko et al.
patent: 63-86551 (1988-04-01), None
patent: 7-237708 (1995-09-01), None
patent: 8-78418 (1996-03-01), None
Japanese language search report for Int'l Appln No. PCT/JP97/02075 dated Sep. 2, 1997.
English language translation of Japanese language search report.
Eguchi Shinzo
Higashi Kazushi
Hirotani Kouji
Imanishi Makoto
Otani Hiroyuki
Dunn Tom
Johnson Jonathan
Matsushita Electric - Industrial Co., Ltd.
Ratner & Prestia
LandOfFree
Bump bonding device and bump bonding method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bump bonding device and bump bonding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bump bonding device and bump bonding method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2581142