Bulk FinFET device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S300000, C257SE21442

Reexamination Certificate

active

07863122

ABSTRACT:
A finFET structure and a method of fabricating the finFET structure. The method includes: forming a silicon fin on a top surface of a silicon substrate; forming a gate dielectric on opposite sidewalls of the fin; forming a gate electrode over a channel region of the fin, the gate electrode in direct physical contact with the gate dielectric layer on the opposite sidewalls of the fin; forming a first source/drain in the fin on a first side of the channel region and forming a second source/drain in the fin on a second side of the channel region; removing a portion of the substrate from under at least a portion of the first and second source/drains to create a void; and filling the void with a dielectric material. The structure includes a body contact between the silicon body of the finFET and the substrate.

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Quirk and Serda, Semiconductor Manufacturing Technology, Prentice Hall, Upper Saddle River, New Jersey, 2001, pp. 289.
Office Communication (Mail Date Mar. 30, 2010) for U.S. Appl. No. 11/923,121, filed Oct. 24, 2007; Art Unit 2813; Confirmation No. 9043.

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