Built-up bump pad structure and method for same

Details Built-up bump pad structure and method for same Built-up bump pad structure and method for same

2005-05-03

2005-05-03

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S737000, C257S738000, C438S613000, C228S180220

Reexamination Certificate

active

06888255

ABSTRACT:
In accordance with the present invention, a built-up bump pad structure and method for the same are provided. The bump pad structure includes a substrate, a bump pad disposed upon the substrate, a solder mask disposed upon the substrate defining an opening around the bump pad, and a conductive material deposited upon the bump pad such that the conductive material at least partially fills the opening around the bump pad.

REFERENCES:
patent: 6335571 (2002-01-01), Capote et al.
patent: 6476494 (2002-11-01), Hur et al.
patent: 6669079 (2003-12-01), Li et al.
patent: 6708871 (2004-03-01), Pierson
patent: 20034201309 (2003-10-01), Grigg et al.
patent: 10-209623 (1998-08-01), None
U.S. Appl. No. 10/445,163, filed May 23, 2003, entitled:System and Method for Increasing Bump Pad Height.

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