Optics: measuring and testing – By configuration comparison – With comparison to master – desired shape – or reference voltage
Patent
1994-07-07
1995-02-28
Evans, F. L.
Optics: measuring and testing
By configuration comparison
With comparison to master, desired shape, or reference voltage
356237, 348131, G01B 1100
Patent
active
053942469
ABSTRACT:
An apparatus for inspecting wires bonded between the pads of a semiconductor chip and the leads of a lead frame including: an illuminating assembly that emits lights, via LED's that are arranged in a ring-shape, onto the object of inspection such as the ball at the end of a bonded wire; an optical assembly that images the object of inspection which is illuminated by the illumination assembly, and cameras that photograph the image taken in by the optical assembly. When the ball, particularly its shape, is inspected, a dark field illumination circumstance is created by the illuminating assembly so that only the ball can appear bright. In this case, a diaphragm of the optical assembly is also adjusted so as to create a shallow focal depth for the ball.
REFERENCES:
patent: 5030008 (1991-07-01), Scott et al.
Evans F. L.
Kabushiki Kaisha Shinkawa
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