Optics: measuring and testing – By configuration comparison – With comparison to master – desired shape – or reference voltage
Patent
1992-12-01
1994-11-15
Evans, F. L.
Optics: measuring and testing
By configuration comparison
With comparison to master, desired shape, or reference voltage
356237, 348126, G01B 1100
Patent
active
053653416
ABSTRACT:
A bonded wire inspection apparatus for inspecting wires bonded between the pads of a semiconductor chip and the leads of a lead frame being made up by an objective lens group that takes in an image of an object of inspection (such as a bonding wire, ball at the end of the wire, etc.), imaging lens groups that image the image taken in by the objective lens group, and cameras that photograph the images taken by the imaging lens groups, and these being all installed in an opto-head. The objective lens group is moved in a vertical direction by a Z-direction drive motor. Thus, the over all size of the inspection apparatus can be compact, dirt, etc. that has a deleterious effect on the object of inspection can be avoided, and the inspection precision can be significantly high.
REFERENCES:
patent: 5030008 (1991-07-01), Scott et al.
Evans F. L.
Kabushiki Kaisha Shinkawa
LandOfFree
Bonding wire inspection apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bonding wire inspection apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding wire inspection apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1101755