Optics: measuring and testing – By configuration comparison – With comparison to master – desired shape – or reference voltage
Patent
1992-10-29
1994-11-29
Evans, F. L.
Optics: measuring and testing
By configuration comparison
With comparison to master, desired shape, or reference voltage
356237, 348126, G01B 1100
Patent
active
053694929
ABSTRACT:
An apparatus for inspecting conditions of bonding between, for example, a semiconductor chip and a lead frame including a camera that images objects such as bonding wires, and ball parts and crescents of the wires, a vertical illuminating assembly installed beneath the camera so as to illuminate the objects vertically, and a ring-form illuminating assembly made up of LED's arranged in a concentric circles so as to illuminates the objects from above diagonally. With such illuminating assemblies, clear images of the object are taken easily by the camera for inspection and measuring purposes.
REFERENCES:
patent: 5030008 (1991-07-01), Scott et al.
Evans F. L.
Kabushiki Kaisha Shinkawa
LandOfFree
Bonding wire inspection apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bonding wire inspection apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding wire inspection apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-77140