Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2006-01-10
2006-01-10
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
Reexamination Certificate
active
06984895
ABSTRACT:
A bonding pad structure in an integrated circuit (IC) and a method for manufacturing thereof comprises a plurality of dummy patterns deposited in sub-layers of the IC, each dummy pattern being connected via a metal link to a plurality of complementary top surface bonding pads, wherein the dummy patterns and the metal link are constructed during the same process steps used to construct the circuit elements included in the IC, without additional or special process steps. Such an imbedded and anchored bonding pad provides contact reliability for both conductive and non-conductive pads used for the interconnection of integrated circuits in a manner that resists layer separation or de-lamination under pulling stresses that are present on the bonding pads.
REFERENCES:
patent: 4495222 (1985-01-01), Anderson et al.
patent: 5248903 (1993-09-01), Heim
patent: 5309025 (1994-05-01), Bryant et al.
patent: 5357136 (1994-10-01), Yoshioka
patent: 5386382 (1995-01-01), Ahn
patent: 5502337 (1996-03-01), Nozaki
patent: 5707894 (1998-01-01), Hsiao
patent: 5736791 (1998-04-01), Fujiki et al.
patent: 5813664 (1998-09-01), Pan
patent: 5923088 (1999-07-01), Shiue et al.
patent: 6037668 (2000-03-01), Cave et al.
patent: 6163074 (2000-12-01), Lee et al.
patent: 6232662 (2001-05-01), Saran
patent: 6300688 (2001-10-01), Wong
patent: 6344410 (2002-02-01), Lopatin et al.
patent: 2001/0010407 (2001-08-01), Ker et al.
Cho Tai-Heui
Kang Hyuck-Jin
Kim Byung-Yoon
Kim Min-Chul
Lee & Morse P.C.
Samsung Electronics Co,. Ltd.
Weiss Howard
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